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Progressive Die Stamping Board Level Shields - High-Precision EMI/RFI Shielding Solutions

Product Overview

As a professional Chinese manufacturer with over 10 years of experience in precision progressive die design and stamping production, we specialize in the R&D, manufacturing and customization ofProgressive Die Stamping Board Level Shields, a core electronic shielding component dedicated to solving electromagnetic interference (EMI) and radio frequency interference (RFI) problems in precision electronic equipment. Developed and produced by our expert engineering team, these board level shields combine high precision, stable performance and durable quality, and have become the preferred shielding solution for global merchants in the electronic, automotive, medical and communication industries.

Board level shields are essential protective components installed on circuit boards and precision electronic components, designed to block external electromagnetic and radio frequency interference, ensure stable signal transmission of electronic equipment, and avoid functional failure or signal distortion caused by interference. Relying on mature progressive die stamping technology, we achieve high-efficiency, high-precision mass production of shielding covers, with standardized mold structure, short development cycle and stable quality, supporting full customization to meet the unique shielding needs of different electronic products.

Core Functions

Key Product Features

Our progressive die stamping board level shields stand out in the global market with outstanding performance advantages, meeting the strict requirements of high-end precision electronic equipment for shielding components, and fully solving the pain points of poor fit, unstable shielding effect and low production efficiency of traditional shielding parts.

Mold Design & Manufacturing Specifications

We have developed thousands of sets of special progressive dies for board level shields, with mature and standardized mold structure, stable performance and reliable quality, and the mold development cycle is only 15-20 days, which is far ahead of the industry in efficiency. The mold adopts standard progressive die structure, with a designed service life of up to 1 million strokes, supporting long-term stable mass production.

The upper and lower die sets are made of 6061 aluminum alloy with black anodizing surface treatment, which reduces the overall mold weight by a large margin, facilitating transportation, handling and press installation during production. The upper and lower backup plates and upper holder plates are made of D2 steel, heat treated to HRC56-58, with strong rigidity and wear resistance; the stripper plate and lower die plate also use D2 steel, heat treated to HRC56-58, with good toughness and stability. Core working parts including punches, stripper inserts and die sections are made of DC53 steel, heat treated to HRC60-62, with ultra-high wear resistance; trim steel adopts ASP23 or DC53 material, processed by low-speed wire cutting, and key parts are processed by PG optical grinding and EDM. The mold is equipped with MISUMI standard guide pins and bushings to ensure operation accuracy, and equipped with Kaller high-performance gas springs for stable stamping; all die plates are treated with conventional heat treatment, and no additional post-treatment is required for punches and die sections, ensuring the ultimate precision and service life of the mold.

Wide Application Scenarios

Our progressive die stamping board level shields are widely used in various industries that require precision electromagnetic shielding, covering almost all fields involving high-precision electronic equipment. Core application industries include consumer electronics, for smart phones, tablet computers, display panels, touch screens and small home appliance circuit boards; automotive electronics, for vehicle control systems, intelligent cockpit components and automotive electronic sensors; aerospace and medical equipment, for high-precision medical testing equipment, aerospace electronic modules and precision instruments; telecommunications and new energy, for communication base station RF modules, new energy vehicle control panels and network equipment; in addition, they are also widely used in electromagnetic compatibility (EMC) testing laboratories, to block unwanted signals and ensure the accuracy of testing results.

Our Core Advantages & Service Strength

Frequently Asked Questions (FAQ)

Q1: What materials are available for board level shields, and what is the thickness range?

A: Our board level shields are mainly made of high-conductivity copper, brass and stainless steel, with finished product thickness ranging from 0.2mm to 2mm; our production molds can process materials with a thickness of 0.04mm to 3.00mm, covering ultra-thin to conventional thickness needs.

Q2: What is the processing precision of the shielding cover and mold?

A: The processing tolerance of our molds and finished shielding covers can reach +/-0.007mm, the minimum punching size can reach 0.08mm, ensuring ultra-high dimensional accuracy and perfect fitting with electronic components.

Q3: How long is the mold development cycle, and what is the mold life?

A: The conventional mass production mold cycle is 15-20 days, prototype mold is about 12 days, and T0 samples can be provided in about 20 days for volume production molds; the designed service life of the mold is up to 1 million strokes, supporting long-term stable mass production.

Q4: Can you customize special-shaped or curved board level shields?

A: Yes, we fully support customized design and production of flat, curved, special-shaped and non-standard size shielding covers. You can provide product drawings, samples or functional requirements, and our engineering team will develop exclusive molds for you.

Q5: What industries do you serve besides board level shields?

A: We also serve electronics, mobile phone, new energy, shielding cans, spring contact, metal brackets, drawing parts and other industries, providing various precision stamping dies and finished parts.

Q6: Do you provide after-sales service for molds and products?

A: We provide comprehensive after-sales service, including mold installation guidance, maintenance support, product quality assurance and technical consultation, to solve all problems encountered in production and use for customers.

Q7: Are your production processes environmentally friendly?

A: Yes, we strictly abide by international environmental protection standards, adopt environmentally responsible production processes and raw materials, and carry out green production to meet global environmental protection requirements.

Conclusion

Our Progressive Die Stamping Board Level Shields and supporting precision progressive dies are the ideal solution for efficient, high-precision electromagnetic shielding, combining excellent EMI/RFI shielding effect, ultra-high processing precision, fast delivery and full customization advantages, fully meeting the needs of global electronic manufacturing enterprises.

As a reliable professional manufacturer with rich industry experience and technical strength, we adhere to innovation, quality and customer-centricity, constantly improving product and service quality, and committed to creating high-value shielding solutions for customers. Whether you need standard board level shields or customized special-shaped products and molds, we welcome you to contact us for consultation, quotation and cooperation, and we will serve you wholeheartedly with professional technology and attentive service.



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Add: 2nd Building, Yongbei Shangjiyuan Industrial Zone,Gongming Street, Guangming District, Shenzhen 518106, China
Tel: +86-755-88218546
+86-755-88218546
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